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标题:
EIA/JESD51-2 IC Thermal Test Method Environment
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作者:
KOKO
时间:
2011-5-1 09:42
标题:
EIA/JESD51-2 IC Thermal Test Method Environment
EIA_JESD51-2.pdf
Integrated Circuits Thermal Test Method Environment Conditions -Natural Convection (Still Air)
Contents
Page
1 Introduction 1
1.1 Purpose 1
1.2 Scope 1
1.3 Rationale 1
1.4 References 2
1.5 Definitions 2
2 Environmental conditions for natural convection measurements 2
2.1 Test enclosure assembly 2
2.2 Test fixture support 4
2.3 Edge connector 5
2.4 Thermocouple 5
2.5 Test board 5
2.6 Material 5
3 Thermal measurement procedure and methodology 6
3.1 Device mounting 7
3.2 K factor calibration 7
3.3 Test start-up and initial equilibrium verification 7
3.4 Power level selection and applying power 7
3.5 Verification of thermal steady-state and test completion 8
4 Thermal characterization parameter - YJT junction -to-top center of package
(optional procedure)
8
4.1 Thermocouple placement location 8
4.2 Package thermocouple application 9
4.3 Procedure 9
5 Test conditions to be reported 10
Annex A 11
作者:
Edelweiss
时间:
2011-5-1 09:42
好标准,谢谢
作者:
哈哈哈哈
时间:
2011-5-1 09:42
请问这个方法是如何来的
作者:
huayuan008
时间:
2020-6-2 16:17
好标准,谢谢
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