标题: 芯片级热仿真软件：Icechip [打印本页] 作者: 撒哈拉的泪 时间: 2011-5-1 09:17 标题: 芯片级热仿真软件：Icechip Icechip is a stand-alone tool for component level analysis that allows IC package designers to perform thermal simulations with ease. A smooth process of importing relevant geometry and subsequent processing facilitates analysis of existing package designs as well as what-if analysis. Icechip can import package stack ups from EDA software like Cadence APD, Synopsys Encore or layouts from dwg/dxf format files. Icechip also exports Icepak model files.
Model Creation
Read in package design features from Cadence APD, Synopsys Encore and dwg/dxf format files
Add features if necessary
Assign material properties
Assign boundary conditions and heat dissipation
Complete model creation by stacking up the features
Modeling and Solution Capabilities
Choose between user defined or empirical correlation based convection BC
Can also choose radiation BC
Automatic meshing
Mount component over JEDEC board
Parametric trial capability
Customizable GUI
3D mouse-based view manipulation with dynamic rotation, translation and zoom
Allows mixed units
Allows customization of preferred unit system
Visualization and Reporting
Fully-integrated, interactive, visualization available
Mouse-based view manipulation
View temperature contours on the component features
View component temperature and heat flow reports
Cutting plane contour capability
Online Help and Documentation
Online help available for all panels/menus
Tutorials
