JESD51-8 IC Thermal Test Method Environmental

jesd51-8 Integrated Circuit Thermal Test Method Environmental Conditions--Junction-to-Board.pdf

Integrated Circuit Thermal Test Method Environmental Conditions —Junction-to-Board
JESD51-8

OCTOBER 1999

CONTENTS
1 Scope 1
2 Normative references 1
3 Definitions, symbols, and abbreviations 2
4 Specification of environmental conditions 2
4.1 Thermal test board 2
4.2 Ring style cold plate 2
4.2.1 Material 2
4.2.1 Clamp location 3
4.2.3 Example designs 3
4.3 Insulation requirements 3
4.4 Fluid temperature 4
4.5 Board temperature measurement 4
5 Measured and calculated parameters 5
5.1 Junction-to-board thermal resistance 5
5.2 Temperature sensitive parameter 5
5.3 Determination using Kfactor 6
5.4 Calibration equation 6
6 Test procedure 6
6.1 TSP calibration 6
6.2 Thermal equilibrium 6
6.3 Initial readings 6
6.4 Apply power 6
6.5 Steady state 6
6.6 Steady state measurements 7
7 Usage 7
7.1 Thermal simulation models 7
7.2 Simulation validation 7
7.3 YJB junction-to-board thermal characterization parameter 7
8 Test conditions to be reported 8
Figures
1 Illustration of ring style cold plate 3
2 Top view with insulation removed 4
Tables
1 Thermal measurement test conditions and data parameters 8

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