JESD51-7 High Effective Thermal Conductivity

  
jesd51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.pdf

High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7
FEBRUARY 1999

1 Background
The measurement of the junction-to-ambient (RqJA) thermal characteristics of an integrated circuit (IC) package has historically been carried out using a number of test fixturing methods. The most prominent fixturing method is the soldering of the packaged devices to a printed circuit board (PCB). The characteristics of the test PCBs can have a dramatic (>60%) impact on the measured RqJA. Due to this wide variability, it is desirable to have an industry-wide standard for the design of PCB test boards to
minimize discrepancies in measured values between companies.