JESD15-4 DELPHI Compact Thermal Model Guideline

JESD15-4.pdf

DELPHI Compact Thermal Model Guideline
JESD15-4
OCTOBER 2008
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

Contents
Page
1 Scope 1
2 Normative references 1
3 Definition of the DELPHI compact model 2
3.1 Overview 2
3.2 General criteria for compact models 3
3.3 The DELPHI methodology 3
3.4 The DELPHI compact model 3
4 Generating a DELPHI compact model 4
4.1 Summary of salient steps in the model generation process 4
4.2 Validated detailed model 5
4.3 Defining the objective function 6
4.4 Defining training boundary condition set 7
4.5 Defining surface and internal nodes 8
4.6 Choice of optimization technique 10
4.7 Error estimate 11
5 Application considerations 11
5.1 Overview 11
5.2 Three-dimensional modeling and simulation tools 12
5.2.1. Overview 12
5.2.2. Conduction modelling tools 12
5.2.3. Computational Fluid Dynamics (CFD) tools 12
5.2.4. Representing a DELPHI compact model in 3D space 13
6 Distribution and Availability 15
7 Bibliography 15
Annex A - Table 1 - 38 boundary condition set 16
Figures
Figure 1 - Network compact model 4
Figure 2 - The DELPHI methodology 5
Figure 3 - The 38 boundary condition set 7
Figure 4 - Possible node topology for a PQFP package 8
Figure 5 - Partitioning the top surface of a QFP into two surface nodes 8
Figure 6 - Possible node partitioning of the top surface of a flip-chip BGA package 9
Figure 7 - Subdividing the leads node to handle asymmetric application environments 10
Figure 8 - Embedded DELPHI network 14
Figure 9 - Possible compact representation of a leaded package 14

1 Scope
This guideline specifies the definition and lists acceptable approaches for constructing a compact thermal model (CTM) based on the DELPHI methodology.
The purpose of this document is twofold. First, it aims to provide clear guidance to those seeking to create DELPHI compact models of packages. Second, it aims to provide users with an understanding of the methodology by which they are created and validated, and the issues associated with their use.
The scope of this document is limited to single-die packages that can be effectively represented by a single junction temperature.
The scope of the current document is also limited to steady state compact models. Dynamic compact models (which are necessary for simulating time-dependent behavior) are not covered.
Boundary condition independence is a measure of the predictive capabilities of the model in application-specific environments.