最近完成的NB thermal simulation

各位先進:
分享一個最近完成的NB模擬, 包括DDR, 3G Card, Wi-fi, CPU, MB, Heatpipe, Fan duct, Dual Inlet Blower, Battery module, Keyboard, Chassis. 建模, 計算速度及結果都還算滿意.

1. 模型外觀

  
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2. 模型透視圖

  
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3. 主要元件表面溫度及溫度截面圖

  
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It seems great! If you can share with us is much better.

Have you simplified the model? How about you LCD display temp.?

If you need, I can share the material property and power consumption settings, but I can't share the full model with you. Sorry.

1. I import the full model from 3D CAD file, and then setup the material and power consumption. Almost no simplification.
2. In this case, I didn't build the LCD panel. So, there is no LCD temperature result.

can you share with us abou  mateial property,thanks !

The most important is thermal conductivity properties K (W/mK), the following are some example :
1. Chassis : 100 W/mK
2. Grease : 1.5 W/mK
3. Heatpipe : 4,000 W/mK
4. MB : Normal : 0.331 W/mK
            Planar : 36 W/mK
5. PAD : 2 W/mK
The material inside CPU and chipset are almost orthotropic or planar isotropic.

处于好奇心，能模拟一下你这台电脑在夏天使用（35

我猜測就是大約 35

哦，是吗。呵呵