电子学中相变材料的CFD建模 EN

Modeling Phase Change Material in Electronics using CFD - A Case Study.pdf(645.01 KB)

2000 International Conference on High-Density Interconnect and Systems Packaging

Modeling Phase Change Material in Electronics using CFD - A Case Study
Paul Gauch6 and Weiran Xu
Flomerics Inc.

Abstract
A computational analysis was performed for an electronic system that uses Phase Change Materials (PCMs) to
provide transient thermal control. The analysis is presented as a method for modeling phase change using the
conventional material properties' and a transient analysis for system level thermal models'. This' provides a reliable
thermal analysis using an existing Computational Fluid Dynamics (CFD) tool. A case study is considered in which a
system level CFD model of an elecOvnic enclosure is' modeled without PCM and with PCM retro-fitted in three
configurations. The proposed method greatly simplifies the analysis without compromising the thermal integrity of
the model and solutions can be obtained quickly. Unexpected results' indicate that the system level model provides
important information often lacking in an idealized (non-system) analysis.

Key words: Phase Change Material, Transient, CFD, Latent Heat, and Specific Heat.

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