热设计网

超软导热垫片-索迈电子科技

中国热设计网
热设计网

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  • 产品介绍 Product Introduction

        超软导热垫片具有超低硬度,高压缩性等特点,相对于常规导热垫片具有超低的安装应力,可避免安装应力对芯片或者线路板的破坏。适合对于安装应力要求高和公差较大的场合。

         Ultra soft thermal pad has the characteristics of ultra-low hardness and high compressibility. Compared with common thermal pad, it has ultra-low installation stress, which can avoid the damage of installation stress to chip or circuit board. It is suitable for occasions with high installation stress requirements and large tolerance.

  • 产品特点 Product Features

         -高压缩性,低安装应力 High compressibility, low installation stress

         -更低的接触热阻 Lower contact thermal resistance

         -适应更大的公差场合 Adapt to larger tolerance occasions

  • 典型应用 Typical Application

         -汽车电子 Automotive electronics

         -家电 Household electrical appliances

         -可穿戴设备 Wearable devices

         -装配应力敏感芯片 Assemble stress sensitive chip

         -公差较大环境 Environment with large tolerance

  • 产品型号 Product Models

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